AI3D2019

(Second International Workshop on Artificial Intelligence for 3D Big Spatial Data Processing)

AI3D2019 Workshop
Co-located with IEEE ISM 2019, San Diego, California, USA, December 9-11, 2019

Weblink: AI3D 2019

Purpose and Scope


Recent advances in laser technology has evolved the importance of 3D spatial data and challenges considering is processing and management. 3D spatial data is usually generated as a stream of points by mounting scanning equipment on drones and cars for large area scanning or on some stationary platform for small area scanning or indoor scanning. The 3D spatial data offer a useful source of information for natural resource management, urban planning, autonomous driving, etc. Artificial intelligence (AI) has the potential to take the 3D spatial data processing into hypergrowth. Recently, 3D indoor mapping systems, terrestrial mobile mapping systems (MMS) and airborne LiDAR systems are capable of collecting terabytes of data (including images and point clouds) in a single scan or on a single trip. Existing approaches and tools lack the efficient management, processing and analysis of 3D spatial data. The solution to this problem lies in the use of Artificial Intelligence and Deep Learning to redefine the workflow. This workshop focuses on the use of Artificial Intelligence and Deep Learning to improve the processing, management and analysis of 3D Big Spatial data. The workshop aims at providing a platform to the group of researchers working in this direction to share their work, exchange ideas, and solve research problems.


Topic of Interest


A list of topics of interest includes but is not limited to:
  • AI and the 3D scanning technologies and devices
  • Use of AI in 3D view registration and surface modeling
  • Intelligent LiDAR data processing, management and analysis
  • Point cloud data processing and analysis
  • 3D modeling and depth image processing
  • Spatio-temporal data processing and analysis
  • Geo spatial data processing and analysis
  • Distributed, parallel and peer-to-peer approaches to index, search and process 3D Big spatial data
  • AI based object detection from point cloud and images
  • Supervised/Unsupervised object annotation in 3D data
  • Point cloud data indexing and querying
  • 3D Big spatial data architectures
  • 3D Big spatial data visualization and analytics
  • 3D Big spatial data cleaning, compression and integration
  • Geographic Information Retrieval
  • Indoor and outdoor mapping
  • 3D mapping
  • Urban Planning
  • Spatial data applications
  • User Interfaces and Visualization

Key Dates

  • Paper submission deadline: September 22, 2019
  • Notification of acceptance: October 21, 2019
  • Camera ready deadline: October 31, 2019
  • Workshop date: December 9, 2019

Special Journal Issues


The AI3D Organizing Committee is proud to announce that the authors of the selected papers will be invited to submit the extended versions of their manuscripts for publication in the Special Issues of the following International Journals:

SENSORS


Sensors (ISSN 1424-8220) provides an advanced forum for the science and technology of sensors and biosensors. The sensor is an Open Access journal with High Visibility (indexed by the Science Citation Index Expanded, MEDLINE, Ei Compendex, Inspec and Scopus) and High Impact Factor(3.031 (2018) ; 3.302 (5-Years))
  • Special Issue for AI3D 2019 selected papers
Click here for further information on the special issue.

REMOTE SENSING


Remote Sensing (ISSN 2072-4292) publishes regular research papers, reviews, letters and communications covering all aspects of remote sensing science, from sensor design, validation / calibration, to its application in geosciences, environmental sciences, ecology and civil engineering. the remote sensing is an Open Access journal with High Visibility (Science Citation Index Expanded, Scopus, Ei Compendex, and others) and High Impact Factor (4.118 (2018) ; 4.750 (5-Years)).
  • Special Issue for "Data Science, Artificial Intelligence and Remote Sensing"
Click here for further information on the special issue.